2023年1月7日，江西奔力达电路有限公司投产庆典在江西赣州举行。赣州市政府领导，奔力达领导，企业代表、供应商及其他机构代表百余人齐聚一堂。中国电子电路行业协会CPCA副秘书长冼彤出席活动。▲ 奔力达董事长黄祥江(右)、CPCA副秘书长冼彤(左)奔力达董事长黄祥江表示，公司从创办的时候只有2000平方米的铁皮厂房，到现在江西工厂建成了8万多平方米的高大厂房，整整

In order to practice the "six improvements" and integrate its connotation and essence into the daily work and actions of employees, the company's "six improvements" Implementation Committee specially carried out the theme of "improving self happiness index in the enterprise, I suggest, I can do it!"

The heat generated by the working of electronic equipment makes the internal temperature of the equipment rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, the device will fail due to overheating, and the reliability of electronic equipment will decline.

With the increasing density of circuit board, signal crosstalk is always a problem that can not be ignored. Because it will not only affect the normal operation of the circuit, but also increase the electromagnetic interference on the circuit board.

Bending and warping are easy to occur when PCB circuit board is produced through reflow oven. How to prevent bending and warping when PCB circuit board is produced through reflow oven is explained in detail below:

Wireless router, like other wireless products, belongs to radio frequency (RF) system. It needs to work in a certain frequency range to communicate with other devices. 2.4GHz is one of the frequency bands widely used by early wireless routers, with a high penetration rate.

The purpose of gold deposition process is to deposit nickel gold coating with stable color, good brightness, flat coating and good solderability on the surface of printed circuit. It can be divided into four stages:

Gold plated board and gold-plated board are commonly used in circuit board production. With the increasing integration of IC, IC pins are more and more dense. In addition, the shelf life of the solder plate is very short.

In order to further understand electronic products, it is necessary for us to understand the manufacturing process of circuit board, integrated circuit, single chip microcomputer, CPU and chip, so as to deepen our understanding of them.